The College of Engineering is pleased to share that our partner institution, Multimedia University (MMU), will host the NexSymp Summit 2026. Faculty members and researchers are warmly invited to submit papers and participate in this virtual international symposium.

📅 Event Information

• Event: NexSymp Summit 2026
• Date: 29–30 September 2026
• Format: International interdisciplinary symposium

📚 Conference Tracks

The symposium covers a wide range of disciplines, including:

• Creative Multimedia (AI-CREM)
• Business, Social Science and Communication (BIZSCOM)
• Information Technology (SITWE)
• Law (SNAIL)
• Engineering (STERO)
• Interdisciplinary AI (INNOV-AI)

⏰ Important Date

• Submission Deadline: June 1, 2026

👉 Interested participants are encouraged to prepare and submit their papers in advance.

✨ Highlights

• Multiple submission tracks (journals and Scopus-indexed publications)
• Platform for international academic exchange
• Opportunities to serve as keynote speaker, session chair, or Technical Program Committee (TPC) member

🔗 More Information

• Main website: https://www.mmupress.com/nexsymp2026/
• SITWE symposium: https://www.mmupress.com/sitwe2026/
• Journal (JIWE): https://journals.mmupress.com/index.php/jiwe

Faculty members and researchers in relevant fields are encouraged to participate and contribute to this international academic event.